Enhanced and Reusable Poly(hydroxy urethane)-Based Low Temperature Hot-Melt Adhesives

Abstract

[EN] Poly(hydroxy urethane)s (PHUs) based on 5-membered cyclic carbonates have emerged as sustainable alternatives to conventional isocyanate-based polyurethanes. However, while from the point of view of sustainability they represent an improvement, their properties are still not competitive with conventional polyurethanes. In this work, the potential of PHUs as reversible hot-melt adhesives is discussed. We found that with a judicious choice of reagents (ie., the dicyclic carbonate and diamine), the detrimental hydrogen bonding between the soft segment of the chains and the pendant hydroxyl groups was partially avoided, thus imparting PHUs with hot-melt adhesion properties (i.e., adhesion at elevated temperatures and cohesiveness at a temperature lower than T-g/T-m). The importance of a balanced hard to soft segment ratio, along with the relevance of the chain extender in the final properties, is highlighted. Addition of aliphatic diamines (HMDA, 1,12-DAD) resulted in rubbery materials, while the employment of cydoaliphatic (CBMA) or aromatic ones (MXDA, PXDA) led to materials with hot-melt adhesive properties. The thermoreversibility of all compositions was assessed by rebonding specimens after lap-shear tests. Lap-shear strength values that were comparable to the virgin adhesives were observed. The breaking and reformation of hydrogen bonding interactions was demonstrated by FTIR measurements at different temperatures, as well as by rheological frequency sweep experiments. In order to mitigate the negative impact of the low molar mass PHUs and to enhance the service temperature of the adhesives, a hybrid PHU was prepared by adding a small amount of an epoxy resin, which acts as a cross-linker. These hybrid PHUs maintain the thermoreversibility displayed by thermoplastic PHUs while providing better adhesion at elevated temperatures. We believe that this work provides some important insights into the design of PHU-based hot-melt adhesives.