Aero Grade Epoxy Vitrimer towards Commercialization
Ruiz de Luzuriaga, Alaitz
M. Salaberria, Asier
Grande, Hans Jürgen
Ruiz de Luzuriaga, A.; Markaide, N.; Salaberria, A.M.; Azcune, I.; Rekondo, A.; Grande, H.J. Aero Grade Epoxy Vitrimer towards Commercialization. Polymers 2022, 14, 3180. https://doi.org/ 10.3390/polym14153180
Traditional crosslinked aero grade epoxy resins have excellent thermal-mechanical properties and solvent resistance, but they cannot be remolded, recycled, or repaired. Vitrimers can be topologically rearranged via an associative exchange mechanism, endowing them with thermoplasticity. Introducing dynamic bonds into crosslinked networks to obtain more sustainable thermosets is currently an interesting research topic. While recent research into vitrimers has indicated many advantages over traditional thermosets, an important shortcoming has been identified: susceptibility to creep at service temperature due to the dynamic bonds present in the network. In addition, designing aero grade epoxy vitrimers (similar to RTM6 resin) still remains a challenge. Herein, low creep aero grade epoxy vitrimer with thermal and mechanical properties similar to those of aero grade epoxy resins and with the ability to be recyclable, repairable, and reprocessable, has been prepared. In this manuscript, we demonstrate that aero grade epoxy vitrimer with reduced creep can be easily designed by the introduction of a certain fraction of permanent crosslinks, without having a negative effect on the stress relaxation of the material. Subsequently, the mechanical and relaxation properties were investigated and compared with those of classical aero grade epoxy resin. A high Tg (175 C) epoxy vitrimer was obtained which fulfilled all mechanical and thermal specifications of the aero sector. This work provides a simple network design to obtain aero grade epoxy resins with excellent creep resistance at elevated temperatures while being sustainable.
Bestelakorik adierazi ezean, itemaren baimena horrela deskribatzen da:2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https:// creativecommons.org/licenses/by/ 4.0/).