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Implicit Subspace Iteration to Improve the Stability Analysis in Grinding Processes
(MDPI, 2020-11-19)
An alternative method is devised for calculating dynamic stability maps in cylindrical and centerless infeed grinding processes. The method is based on the application of the Floquet theorem by repeated time integrations. ...
Influence of AISI D2 Workpiece Roughness on Heat Partition and Plasma Channel Radius in the WEDM Process
(MDPI, 2020-10-12)
As an important advanced machining process, in Wire Electrical Discharge Machining (WEDM) certain fundamental issues remain need to be studied in-depth, such as the effect of part surface roughness on heat transfer mechanisms. ...
An Original Tribometer to Analyze the Behavior of Abrasive Grains in the Grinding Process
(MDPI, 2018-07)
Manufacturing of grinding wheels is continuously adapting to new industrial requirements. New abrasives and new wheel configurations, together with wheel wear control allow for grinding process optimization. However, the ...